On 4 December 2018, a ceremony was held at Universiti Sains Malaysia (USM)’s Nibong Tebal Campus for the signing of the Toray Group Malaysia Scholarship agreement with the selected recipients.
This year, Toray Group companies in Malaysia (hereinafter referred to as “TGM”) granted scholarships to five first year undergraduates of USM in the fields of mechatronics, mechanical, chemical, and electrical and electronics engineering.
Teh Hock Soon, Toray Industries, Inc.’s Chief Representative for Malaysia and V. Rajendran, Associate Director cum Deputy General Manager of Group Human Resources of Toray Industries (Malaysia) Sdn. Berhad (TML), were present to act as signatory and witness of the scholarship agreements on behalf of TGM. Professor Dr. Nor Azazi Bin Zakaria, Director of Engineering Campus, together with Professor Dr. Azlina Binti Harun @ Kamaruddin, Dean of Chemical Engineering Education Center of USM, also witnessed the ceremony. After the conclusion of the signing ceremony, Teh presented a 55-inch TV to the USM Engineering Library sponsored by TGM for the purpose of information dissemination, including TGM related news that could be updated online remotely.
As part of TGM’s corporate social responsibility (CSR) initiative to enhance local higher education and human capital development in the country, TGM has being giving out scholarships to USM students since 2012, with a total of 37 recipients to date.
(Peter Liew, TML)
